Wafer processing system

ABSTRACT

A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a “single” chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention generally relates to semiconductor device fabrication andmore particularly to systems for processing a semiconductor wafer.

2. Description of the Related Art

Specialized wafer processing systems are used to process semiconductorwafers into electronic devices. In most wafer processing systems, acarrier containing wafers is loaded into a loading station andtransferred to a loadlock. Subsequently, a robot picks up a wafer fromthe carrier and moves the wafer into a reactor. The wafer is processedin the reactor according to a recipe. Once the wafer has been processed,the robot picks up and transfers the wafer back to the carrier in theloadlock. The carrier is then moved out of the loadlock and back intothe loading station.

Gate valves are routinely employed in a variety of circumstances wherewafers are moved from an area at a first pressure to an area at adifferent, second pressure. In general, the gate valve is a device whichis used to isolate operational areas in a wafer processing environment,such that the internal pressures within the operational areas can bevaried. The gate valve also reduces particulate contamination betweenoperational areas, which may otherwise be problematic to certain waferprocesses.

Unfortunately, the use of gate valves in the processing system also hasdrawbacks. For example, gate valves generally include large numbers ofexposed joints, bearings, hinges, and the like, which generateparticulates whenever the gate valve is actuated. These particulates candeposit on the wafers and interfere with the processing operation.Moreover, such joints are difficult to lubricate in a low pressureenvironment, where the lubrication fluid quickly vaporizes. In addition,location of the gate valve within the processing system usuallyincreases the size of the system. Typically, the increased size of thesystem, increases the time and power required to draw a vacuum, as wellas increasing the capital costs associated with manufacturing thesystem.

For these reasons, it would be desirable to provide a wafer processingsystem which does not require vacuum isolation between operational areasof the processing system.

SUMMARY OF THE INVENTION

The present invention provides a wafer processing system which requiresno isolation between the operational areas within the processing system.The system of the present invention includes operational areas, such asa loading area, a transport area, and a reactor or thermal processingarea. Advantageously, since there are no isolation devices or gatevalves separating the areas, the processing system effectively has eachoperational area combined into a “single” chamber. Preferably, thesingle chamber has a single slit valve, hinge door, or other vacuumsealable door disposed proximate to the loading area to allow for theremoval/insertion of the wafers into the loading area. Once the door tothe loading area has been closed the internal pressure within thechamber can be kept uniform throughout each operational area.

In one aspect of the invention, a wafer processing apparatus is providedwhich includes a chamber. Within the chamber are a loading area, athermal processing area; and a transport area. The loading area, thetransport area, and the thermal processing area remain in environmentalcommunication during performance of a wafer processing operation in saidwafer processing area.

In another aspect of the invention, a system is provided for processinga semiconductor wafer. The system includes a first compartmentconfigured for receiving wafers to be processed. The system alsoincludes a second compartment disposed adjacent to the firstcompartment, which includes a transport mechanism operable fortransporting the wafers. A third compartment is disposed adjacent to thesecond compartment, which is used for thermally processing the wafers.The first compartment, the second compartment, and the third compartmentare in environmental communication while the wafer is being thermallyprocessed in the third compartment.

A processing system which includes the operational areas combinedtogether in effectively a single chamber removes the possibility ofpressure fluctuations from occurring during processing. Because theoperational areas in the chamber are under one pressure, the waferthroughput can be increased. Further, since there is one chamber volumethere is no need for multiple pumps in the system. The present inventionis particularly useful in thermal processes, such as annealing and somechemical vapor deposition processes.

Other uses, advantages, and variations of the present invention will beapparent to one of ordinary skill in the art upon reading thisdisclosure and accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show a side view and a top view, respectively, of awafer processing system in accordance with the invention;

FIGS. 2A and 2B show a side view and a top view, respectively, of aloading station in accordance with the invention;

FIG. 3 shows a cross-sectional view of a bar used in the loading stationshown in FIG. 2A;

FIG. 4A shows a functional “x-ray” view of a wafer processing robot inaccordance with the invention;

FIG. 4B shows a magnified view of a portion of the robot shown in FIG.4A;

FIGS. 4C and 4D show top “x-ray” views of a robot in one embodiment ofthe invention;

FIG. 5 shows in block diagram form a control system for controlling thewafer processing system shown in FIGS. 1A and 1B;

FIGS. 6A-6E illustrate in graphical form the movement of a platform inthe loading station shown in FIGS. 2A and 2B;

FIGS. 7A and 7B show side views of the loading station shown in FIGS. 2Aand 2B;

FIGS. 8A-8F show side views of the wafer processing system shown in FIG.1A illustrating the movement of a wafer from a carrier in a load lock toa reactor;

FIG. 9 shows a functional diagram of a sensor configuration for trackingthe position of a platform in the loading station shown in FIGS. 2A and2B;

FIGS. 10A and 10B show side views of a loading station and a load lockin one embodiment of the invention;

FIG. 11A shows a perspective view of a load lock and a platform inaccordance with the invention;

FIG. 11B shows a side cross-sectional view of the load lock and platformshown in FIG. 11A;

FIGS. 12A and 12B are simplified illustrations of a top plan view and aside view, respectively of an embodiment of the processing system of thepresent invention;

FIG. 12C is a simplified illustration of a side view of an alternativeembodiment of the present invention;

FIG. 13A, is a simplified illustration of a partial cross-sectional sideview of a first compartment (loading area) in accordance with thepresent invention;

FIG. 13B is a simplified illustration of an alternative embodiment tothe first compartment of FIG. 13A; and

FIGS. 14, 14A, and 14B are illustrations of various views of anembodiment of a cooling station in accordance with the presentinvention.

DETAILED DESCRIPTION

FIGS. 1A and 1B show a side view and a top view, respectively, of awafer processing system 100 in accordance with the present invention.System 100 includes a loading station 10, a load lock 12, a transferchamber 20, a robot 21, reactors 30 and 40, and a cooling station 60.Loading station 10 has platforms 11A, 11B, and 11C for supporting andmoving wafer carriers, such as a wafer carrier 13, up into load lock 12.While three platforms are used in this embodiment, the invention is notso limited. Two platforms can also be used as can additional platformsto increase throughput. Carrier 13 is a removable wafer carrier whichcan carry up to 25 wafers at a time. Other types of wafer carriers,including fixed wafer carriers, can also be used. Wafer carriers areloaded onto platforms 11A, 11B, and 11C either manually or by usingautomated guided vehicles (“AGV”).

While the movement of a wafer carrier into load lock 12 is illustratedherein using carrier 13 on platform 11A as an example, the sameillustration applies to the movement of other wafer carriers usingplatforms 11B and 11C. Further, because platforms 11A, 11B, and 11C arestructurally and functionally the same, any reference to platform 11Aalso applies to platforms 11B and 11C. Referring to FIGS. 2A and 2B,which show a side view and a top view of loading station 10, platform11A includes a driving bar 209 which is coupled to a triangular block207 via bearings 217. A motor 205 is mechanically coupled to an adapterblock 219 using a flexible coupler 206. Adapter block 219 is fixedlyattached to triangular block 207. By rotating adapter block 219, motor205 can thus rotate triangular block 207 which, in turn, rotatesplatform 11A about a pole 208. The rotation of platform 11A about pole208 is illustrated in FIGS. 6A to 6E. FIGS. 6A to 6C sequentially showtop views of platform 11A as it is rotated from a position 610 to aposition 611 in a direction indicated by an arrow 613. FIG. 7A shows aside view of loading station 10 when platform 11A is in position 611.FIGS. 6C to 6E show top views of platform 11A rotating from position 611to a position 612 in a direction indicated by an arrow 614. FIG. 7Bshows a side view of loading station when platform 11A is in position612.

Referring to FIG. 2B, a belt 202 is wound through a fixed center pulley204, fixed platform pulleys 201, and idlers 203 so that opening 601 ofwafer carrier 13 through which wafers are inserted (FIGS. 6A-6E) facestowards robot 21 as platform 11A is rotated about pole 208. Tension onbelt 202 is set by adjusting idlers 203.

Referring to FIG. 9, the position of platform 11A in loading station 10is tracked using a sensor 901 and a flag 905. Flag 905 is attached to apredetermined location on triangular block 207. The position where flag905 passes through sensor 901 is known as the “home” position. In oneembodiment, the output of sensor 901 is coupled to a motor controller902 via a line 903. The output of motor 205, which can be an encoderoutput, is also coupled to motor controller 902 via a line 904. Whenflag 905 passes through sensor 901, sensor 901 outputs a “home signal”to motor controller 902 indicating that triangular block 207 is in thehome position. By monitoring line 904, motor controller 902 determinesthe number of rotation that motor 205 makes after the receipt of thehome signal. Because the location of platform 11A relative to the homeposition is predetermined, the location of platform 11A as it rotatesabout pole 208 can then be tracked by motor controller 902.

As shown in FIG. 7B, a cam 212 engages a slotted disk 213 when platform11A is in position 612. Cam 212 is attached to driving bar 209 which, inturn, is attached to platform 11A. Once motor controller 902 indicatesthat platform 11A is in position 612, air pressure is provided into apneumatic cylinder 210 to push a piston 211 upwards. Consequently,slotted disk 213 engages cam 212 to push platform 11A up into load lock12 as shown in FIG. 2A. Bar 209 has a cross-section as shown in FIG. 3,which is taken along section III—III in FIG. 2A, to prevent rotation ofplatform 11A during vertical motion. To avoid jarring wafer carrier 13on platform 11A, the air pressure provided to pneumatic cylinder 210 isregulated such that a high pressure is initially provided and thengradually decreased as platform 11A approaches load lock 12.

The rotational movement of platforms 11A, 11B, and 11C into position 612minimizes the floor space occupied by loading station 10. As is evidentfrom FIG. 2B, loading station 10 occupies just enough area toaccommodate the number of platforms used which, in the particularembodiment shown in FIG. 2B, is three.

In one embodiment, the platforms of a loading station 10A, which isshown in FIG. 10A, are not elevated into a load lock 1012. In loadingstation 10A, a motor 205A, a flexible coupler 206A, an adapter block219A, and a triangular block 207A are functionally and structurally thesame as their counterparts in loading station 10 (i.e. motor 205A is thesame as motor 205, etc.). Except for a platform 1010A not having a longdriving bar such as driving bar 209 of platform 11A, platform 1010A isotherwise the same as platform 11A. In contrast to the operation ofplatform 11A in loading station 10, platform 1010A is not elevated intoload lock 1012. Instead, platform 1010A is rotated into a position(“load lock position”) where platform 1010A can be enclosed within loadlock 1012. In FIG. 10A, the load lock position is just below load lock1012. Once platform 1010A is in the load lock position, load lock 1012is lowered to enclose platform 1010A as shown in FIG. 10B. A robot (notshown) in transfer chamber 1020 can then access the wafers in a wafercarrier 1013. Load lock 1012 is raised and lowered using conventionalstructures. For example, load lock 1012 can be fitted with a ball screwand then lifted by rotating the ball screw using a motor. As in loadingstation 10, the rotational movement of platform 1010A minimizes thefloor space requirement of loading station 10A.

As shown in FIG. 2A, load lock 12 is bolted onto transfer chamber 20 andis further supported by pole 208 through hinges 215 and 216. Pole 208freely rotates through hinge 215, hinge 216, and bearings 218 to preventvibrations from motor 205 from being transmitted into load lock 12. FIG.11A shows a perspective view of load lock 12. In FIG. 11A, pole 208 andother components of system 100 are not shown for clarity. Load lock 12includes a viewing port 1102 on a side 1105 to allow visual inspectionof the insides of load lock 12. Viewing port 1102 is made of atransparent material such as quartz. Referring to FIG. 11B, which showsa partial side cross-sectional view of load lock 12, viewing port 1102is bolted on load lock 12 with bolts 1103. A surrounding seal 1106 (e.g.o-ring or lip seal) between viewing port 1102 and side 1105 is providedto create a vacuum seal. Similarly, load lock 12 is bolted on transferchamber 20 with bolts 1104. A surrounding seal 1107 between load lock 12and transfer chamber 20 creates a vacuum seal. When platform 11A is upin load lock 12, a surrounding seal 214 on platform 11A (FIG. 11B)contacts the bottom opening portion of load lock 12. During processingwhich requires vacuum, pneumatic cylinder 210 pushes platform 11A upinto load lock 12 such that seal 214 is compressed against load lock 12to create a vacuum seal. Also, vacuum within load lock 12 draws inplatform 11A into load lock 12, further enhancing vacuum sealing. Asaving in floor space is achieved by vertically mounting load lock 12which, in this particular embodiment, is above loading station 10.

In accordance with the invention, robot 21 is provided for transportingwafers to and from the modules of system 100 such as reactors 30 and 40,cooling station 60, and load lock 12. FIG. 4A shows an “x-ray” view ofan embodiment of robot 21. To improve the clarity of illustration byshowing all the relevant parts of robot 21 in one view, FIG. 4A is afunctional representation of robot 21 and does not depict actual partsplacement. For example, the actual location of a ball screw 402 inrelation to the location of linear guides 405A and 405B is depicted inthe top view shown in FIG. 4C. Of course, the invention is not limitedto the specific parts, structures, and parts placement shown in FIGS.4A-4C. As shown in FIG. 4A, a z-axis (i.e. vertical motion) motor 401 ismechanically coupled to and rotates ball screw 402 via a belt 451. Acollar 404 rides on and is driven by ball screw 402. In this embodiment,z-axis motor 401 is the type Part Number SGM-04A314B from YaskawaElectric (“Yaskawa Electric”) of Fukuoka, Japan (telephone no.81-93-645-8800) while ball screw 402 is the type Part NumberDIK2005-6RRG0+625LC5 from THK Corporation Limited (“THK”) of Tokyo,Japan (telephone no. 81-3-5434-0300). Other conventional ball screws andmotors can also be used. A support unit 452 (e.g. THK Part Number FK15)supports ball screw 402. A vertical driver 403, which rides on collar404, can be moved up or down by using z-axis motor 401 to drive collar404 via ball screw 402. Vertical driver 403 slides against wear rings453. Wear rings, generally, prevent metal to metal contact and absorbtransverse loads. In one embodiment, wear rings 453 are the type PartNumber GR7300800-T51 from Busak+Shamban (“Busak+Shamban”) (Internet website “www.busakshamban.com”). Robot 21 also includes a harmonic gear 461which can be of the same type as Part Number SHF-25-100-2UH fromHarmonic Drive Systems Inc. of Tokyo, Japan (telephone no.81-3-5471-7800).

As shown in FIG. 4B, which is a magnified view of a portion of robot 21defined by dashed-lines IV—IV shown in FIG. 4A, seals 418 surroundvertical driver 403 and a rotation driver 415 to create a vacuum seal.Seals 418 can be any type of seal which does not expand and compresswith a moving part being vacuum sealed. For example, seals 418 can beo-rings, lip-seals, or t-seals (as opposed to bellows). In oneembodiment, seals 418 are of the type Part Numbers TVM300800-T01S,TVM200350-T01S from Busak+Shamban. In the prior art, bellows have beenused in wafer processing robots to create a vacuum seal around a movingpart such as vertical driver 403. Because bellows expand and compresswith the moving part, bellows are necessarily made larger when used withmoving parts having a long range of motion. This makes bellowsimpractical in a semiconductor processing robot having a range of motiongreater than 200 mm. In one embodiment of robot 21, the use of seals418, instead of bellows, allows vertical driver 403 to be raised up to350 mm. Thus, robot 21 can access multiple vertically mounted modules.To keep seals 418 in place as vertical driver 403 is moved up and down,vertical driver 403 is stabilized using linear guides 405A (FIGS. 4A and4C) and 405B (FIG. 4C) (e.g. THK Part Number HSR25LBUUC0FS+520LF-II).

Referring to FIG. 4A, robot 21 includes an end-effector 406, which ismade of a heat resistant material such as quartz, for picking-up andplacing a wafer. End-effector 406 is fixedly attached to an attachmentblock 407 which accepts a variety of end-effectors. Block 407 isattached onto an arm 408 and rotates about an axis 410. Arm 408 rotatesabout an axis 411 and is attached onto an arm 409. As shown in FIG. 4D,a conventional belt and pulley arrangement, which includes pulleys455-458 and belts 459-460, mechanically couples arm 409, arm 408, andblock 407 (which is coupled to pulley 458) together. End effector 406,which is attached to block 407, can be extended or retracted along astraight line by rotating pulley 455 using an extension motor 413 (FIG.4A) (e.g. Yaskawa Electric Part Number SGM-02AW12). The entire armassembly consisting of arm 409, arm 408, block 407, and end-effector406, can be rotated about an axis 412 by using a rotation motor 414(FIG. 4A) (e.g. Yaskawa Electric Part Number SGM-02AW12) to rotaterotation driver 415 via a belt 454. FIG. 4C is a top view showing theplacement of z-axis motor 402, linear guides 405A and 405B, extensionmotor 413, rotation motor 414, and ball screw 402 in an embodiment ofrobot 21.

Referring to FIG. 4A, inlets 416 are provided to allow a coolant to flowthrough cooling channel 417 (also shown in FIG. 4B) and cool robot 21during high temperature processing such as RTP. Any conventional coolantmay be used including water, alcohol, and cooled gas. The use ofinternal cooling and a heat resistant end-effector in robot 21 decreasesthe processing time of system 100 as robot 21 can transport a wafer inand out of a reactor without waiting for the reactor or the wafer tocool down.

FIGS. 8A to 8F show side views of system 100 illustrating the movementof a wafer 22 from carrier 13, which is inside load lock 12, to areactor 30 (or 40). Once carrier 13 is inside load lock 12, robot 21 intransfer chamber 20 rotates and lowers towards load lock 12 (FIG. 8A).Robot 21 extends end-effector 406 to pick up wafer 22 from wafer carrier13 (FIG. 8B). Robot 21 then retracts (FIG. 8C), rotates towards reactor30 (FIG. 8D), elevates to position wafer 22 in-line with reactor 30(FIG. 8E), and places wafer 22 into reactor 30 through a gate valve 31(FIG. 8F). Robot 21 then retracts and, subsequently, gate valve 31closes to begin the processing of wafer 22.

Referring to FIG. 1A, reactors 30 and 40 are rapid thermal processing(“RTP”) reactors in this particular embodiment. However, the inventionis not limited to a specific type of reactor and may use anysemiconductor processing reactor such as those used in physical vapordeposition, etching, chemical vapor deposition, and ashing. Reactors 30and 40 may also be of the type disclosed in commonly-owned U.S. patentapplication Ser. No. 09/451,494, entitled “Resistively Heated SingleWafer Furnace,” filed on Nov. 30, 1999 now U.S. Pat. No. 6,303,906,issued Oct. 16, 2001, which is incorporated herein by reference in itsentirety. Reactors 30 and 40 are vertically mounted to save floor space.Reactors 30 and 40 are bolted onto transfer chamber 20 and are furthersupported by a support frame 32. Process gases, coolant, and electricalconnections are provided through the rear side of reactors 30 and 40using interfaces 33.

A pump 50, shown in FIG. 1A, is provided for use in processes requiringvacuum. In the case where the combined volume of reactors 30 and 40 is alot less than the combined volume of load lock 12, cooling station 60,and transfer chamber 20, a single pump 50 may be used to pump down theentire volume of system 100 (i.e. combined volume of load lock 12,cooling station 60, transfer chamber 20, reactor 30, and reactor 40) tovacuum. Otherwise, additional pumps such as pump 50 may be required toseparately pump down reactors 30 and 40. In this particular embodiment,a single pump 50 suffices because the combined volume of load lock 12,cooling station 60, and transfer chamber 20 is approximately 150 literswhereas the total volume of reactors 30 and 40 is approximately 2liters. In other words, because the combined volume of reactors 30 and40 is insignificant compared to the entire volume of system 100,reactors 30 and 40 do not significantly affect the pressure withinsystem 100. Thus, a separate pump is not needed to control the pressurewithin reactors 30 and 40.

After wafer 22 is processed in a well known manner inside reactor 30 (or40), gate valve 31 opens to allow robot 21 to move wafer 22 into coolingstation 60 (FIG. 1A). Because newly processed wafers may havetemperatures upwards of 200° C. and could melt or damage a typical wafercarrier, cooling station 60 is provided for cooling the wafers beforeplacing them back into a wafer carrier in load lock 12. In thisembodiment, cooling station 60 is vertically mounted above load lock 12to minimize the floor space area occupied by system 100. Cooling station60 includes shelves 61, which may be liquid-cooled, to support multiplewafers at a time. While two shelves are shown in FIG. 1A, of course, adifferent number of shelves can be used, if appropriate, to increasethroughput.

Subsequently, wafer 22 is picked-up from cooling station 60 and replacedto its original slot in carrier 13 using robot 21. Platform 11A lowersfrom load lock 12 and rotates out of position to allow another platformto move a next wafer carrier into load lock 12.

FIG. 5 shows a block diagram of a control system 530 used in system 100.A computer 501 communicates with a controller 520 using an ethernet link502 to an input/output (“I/O”) controller 521. I/O controller 521 canaccommodate a variety of I/O boards including: (a) serial ports 522 forcommunicating with robot, temperature, pressure, and motor controllers(e.g. motor controller 902 shown in FIG. 9); (b) digital I/O 523 forcontrolling digital I/O lines such as sensors; (c) analog I/O 524 forcontrolling analog signal activated devices such as mass flowcontrollers and throttle valves; and (d) relay boards 525 for making orbreaking continuity of signal lines such as interlock lines. Componentsfor building controller 520 are commercially available from KoyoElectronics Industries Co., Ltd., 1-171 Tenjin-cho, Kodaira Tokyo187-0004, Japan, (telephone number: 011-81-42-341-3115). Control system530 uses a conventional control software for activating and monitoringvarious components of system 100. System 100 may also use anyconventional control hardware and software such as those available fromNational Instruments Corporation of Austin, Tex. (internet website“www.ni.com”).

FIGS. 12A and 12B show a side view and a top view, respectively, ofanother embodiment of the wafer processing system in accordance with thepresent invention. System 300 includes a loading station 310, a firstcompartment or loading area 312, a second compartment or transport area314, a third compartment or thermal processing area 316, and a coolingstation 318. Loading station 310 has platforms 311A, 311B, and 311C forsupporting and moving wafer carriers, such as a wafer carrier 320, upinto loading area 312. The structure and function of similar componentsof system 300 are the same as their counterparts in system 100, exceptas described below.

As shown in FIG. 12A, first compartment or loading area 312 can bemounted onto second compartment or transport area 314. Referring to FIG.13A, a partial cross-sectional side view of first compartment 312, isshown. When platform 311A is up in loading area 312, a surrounding seal322 on platform 311A contacts the bottom opening portion of loading area312. During processing which requires vacuum, a pneumatic cylinderpushes platform 311A up into contact with loading area 312, such thatseal 322 is compressed against the outside of first compartment 312 tocreate a vacuum seal. Also, vacuum within system 300 draws in platform311A to further enhance vacuum sealing. Optionally, wafer carriers maybe loaded into loading area 312 from the side of loading area 312. Asshown in FIG. 13B, platform 311A may be replaced with a side door 324.Door 324 may include any door which can provide suitable sealing forprocesses conducted in a vacuum, such as a slit valve, a hinge door, ora conventional gate valve. In the embodiment illustrated in FIG. 12A,platform 311A (or alternatively door 324) is the only isolation deviceused in system 300.

Referring again to FIGS. 12A and 12B, the movement of a wafer 326 fromcarrier 320 to a third compartment or process area 316 is shown. In thisembodiment, once carrier 320 is inside loading area 312 and platform311A (or door 324) is sealed, robot 328 in transport area 314 rotatesand lowers towards loading area 312 to pick up wafer 326 from wafercarrier 320. Robot 328 then retracts, rotates towards third compartment316 and places wafer 326 into process area 316. Robot 228 then retractsso that the processing of wafer 326 may commence. In this embodiment, asrobot 328 moves wafer 326 from loading area 312, through transport area314, and into process area 316, robot 328 need not pass through any gatevalves or isolation devices. The combined loading area 312, transportarea 314, and process area 316 effectively form a “single” chamber,which has no isolation devices between operational areas. In thismanner, the combined volume of the single chamber may be serviced usinga single pump, which may be used to pump down the entire volume ofsystem 300 to vacuum.

After wafer 326 is processed in a well known manner inside process area316, the newly processed wafers may have temperatures upwards of 200° C.and could melt or damage a typical wafer carrier. Cooling station 318 isprovided for cooling the wafers before placing them back into wafercarrier 320. As shown in the embodiment of FIG. 12B, cooling station 318is vertically mounted above loading area 312 to minimize the floor spacearea occupied by system 300. FIG. 12C shows an alternate position forcooling station 318, which may be between second compartment 314(transport area) and third compartment 316 (process area).

FIGS. 14, 14A and 14B show an embodiment of cooling station 318. Coolingstation 318 may include shelves 332, which may be liquid-cooled, tosupport a plurality of wafers simultaneously.

The description of the invention given above is provided for purposes ofillustration and is not intended to be limiting. The invention is setforth in the following claims.

What is claimed is:
 1. A method for wafer processing comprising:providing a chamber including a loading area, a transport area, and athermal processing area; and processing a wafer in said thermalprocessing area while said loading area, said transport area, and saidthermal processing area are in environmental communication.
 2. Themethod of claim 1, further comprising cooling said wafer in a coolingstation while said cooling station is in environmental communicationwith said loading area, said transport area, and said thermal processingarea.
 3. The method of claim 1, wherein said thermal processing areacomprises a rapid thermal processing reactor.
 4. The method of claim 1,wherein said transport area comprises a transport mechanism operable fortransporting said wafer from said loading area to said thermal processarea.